KULTE IN EINER KOREANISCHEN DORFGEMEIN-SCHAFT CULTES DANS UNE COMMUNAUTE VILLAGEOISE DE COREELEE J. K.ZEITSCHRIFT FUR ETHNOLOGIE. 1972, Vol 97, Num 1, pp 22-37Article

KULTE IN EINER KOREANISCHEN DORFGEMEINSCHAFT LES CULTES DANS UN GROUPE DE COMMUNES RURALES EN COREELEE J. K. K.ZEITSCHRIFT FUR ETHNOLOGIE. 1972, Vol 97, Num 1, pp 22-37Article

Properties of B₄C-PbO-Al(OH)₃-epoxy nanocomposite prepared by ultrasonic dispersion approach for high temperature neutron shieldsLEE, M. K; LEE, J. K; KIM, J. W et al.Journal of nuclear materials. 2014, Vol 445, Num 1-3, pp 63-71, issn 0022-3115, 9 p.Article

Carbohydrate response element-binding protein (ChREBP) plays a pivotal role in beta cell glucotoxicityPOUNGVARIN, N; LEE, J. K; YECHOOR, V. K et al.Diabetologia (Berlin). 2012, Vol 55, Num 6, pp 1783-1796, issn 0012-186X, 14 p.Article

Linear inductive antenna design for large area flat panel display plasma processingKIM, K. N; LIM, J. H; JEONG, H. B et al.Microelectronic engineering. 2012, Vol 89, pp 133-137, issn 0167-9317, 5 p.Conference Paper

Anaphylaxis: mechanisms and managementLEE, J. K; VADAS, P.Clinical and experimental allergy (Print). 2011, Vol 41, Num 7, pp 923-938, issn 0954-7894, 16 p.Article

Bronchial hyperresponsiveness to methacholine and adenosine 5'-monophosphate, and the presence and degree of atopy in young children with asthmaSUH, D. I; LEE, J. K; KIM, C. K et al.Clinical and experimental allergy (Print). 2011, Vol 41, Num 3, pp 338-345, issn 0954-7894, 8 p.Article

The mechanism of elevated temperature intergranular cracking in heat-resistant alloysHEO, N. H; CHANG, J. C; YOO, K. B et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2011, Vol 528, Num 6, pp 2678-2685, issn 0921-5093, 8 p.Article

Characterization of SiC_f/SiC and CNT/SiC composite materials produced by liquid phase sinteringLEE, J. K; LEE, S. P; CHO, K. S et al.Journal of nuclear materials. 2011, Vol 417, Num 1-3, pp 371-374, issn 0022-3115, 4 p.Conference Paper

Impacts of Superconducting Fault Current Limiters on the Recloser Operation in Distribution Electric Power SystemsRHEE, S. B; LEE, J. K; LEE, B. W et al.IEEE transactions on applied superconductivity. 2011, Vol 21, Num 3, pp 2197-2200, issn 1051-8223, 4 p., 2Conference Paper

HIGHER ORDER APPROXIMATING NORMALS AND THEIR IMPACT ON ISOSURFACE SHADING ACCURACYWOOD, B. A; LEE, J. K; MASKEY, M et al.Machine graphics & vision. 2010, Vol 19, Num 2, pp 201-221, issn 1230-0535, 21 p.Article

Preannealing, Annealing Atmosphere, and Surface-Energy-Induced Selective Growth in 0.1 Pct Mn-Added 3 Pct Si-Fe Alloy Containing 95 ppm SulfurJUNG, Y. C; LEE, J. K; KIM, K. T et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2009, Vol 40, Num 5, pp 1019-1022, issn 1073-5623, 4 p.Article

Estimation of magnetization loss at angular magnetic field using perpendicular magnetization loss in striated and transposed YBCO coated conductorLEE, J. K; KIM, W. S; PARK, C et al.Physica. C. Superconductivity. 2009, Vol 469, Num 15-20, pp 1432-1435, issn 0921-4534, 4 p.Conference Paper

Optimal design of HTS magnets for a modular toroid-type 2.5 MJ SMES using multi-grouped particle swarm optimizationLEE, S. Y; KWAK, S. Y; SEONG, K. C et al.LEE, S. Y; Physica. C. Superconductivity. 2009, Vol 469, Num 15-20, pp 1789-1793, issn 0921-4534, 5 p.Conference Paper

Prostate-specific antigen and prostate volume in Korean men with spinal cord injury : a case-control studySHIM, H. B; KIM, Y. D; JUNG, T. Y et al.Spinal cord. 2008, Vol 46, Num 1, pp 11-15, issn 1362-4393, 5 p.Article

Sulfonated poly(ether ether ketone) as an ionomer for direct methanol fuel cell electrodesLEE, J. K; LI, W; MANTHIRAM, A et al.Journal of power sources. 2008, Vol 180, Num 1, pp 56-62, issn 0378-7753, 7 p.Article

Characterization of electron irradiated GaN n⁺-p diodeDONG UK LEE; EUN KYU KIM; BYUNG CHEOL LEE et al.Thin solid films. 2008, Vol 516, Num 11, pp 3482-3485, issn 0040-6090, 4 p.Conference Paper

Crystallization of amorphous Ge films induced by semiconductor diode laser annealingSAKAIKE, K; HIGASHI, S; MURAKAMI, H et al.Thin solid films. 2008, Vol 516, Num 11, pp 3595-3600, issn 0040-6090, 6 p.Conference Paper

Enhancement of the lifetime in organic light-emitting devices fabricated utilizing wide-bandgap-impurity-doped emitting layersCHOO, D. C; BANG, H. S; KWACK, B. C et al.Thin solid films. 2008, Vol 516, Num 11, pp 3610-3613, issn 0040-6090, 4 p.Conference Paper

Infinitely high etch selectivity during CH₄/H₂/Ar inductively coupled plasma (ICP) etching of indium tin oxide (ITO) with photoresist maskKIM, D. Y; KO, J. H; PARK, M. S et al.Thin solid films. 2008, Vol 516, Num 11, pp 3512-3516, issn 0040-6090, 5 p.Conference Paper

Prediction of etching results and etching stabilization by applying principal component regression to emission spectra during in-situ cleaningIWAKOSHI, Takehisa; HIROTA, Kosa; MORI, Masahito et al.Thin solid films. 2008, Vol 516, Num 11, pp 3464-3468, issn 0040-6090, 5 p.Conference Paper

Single dopant white electrophosphorescent light emitting diodes using heteroleptic tris-cyclometalated Iridium(III) complexesJI HYUN SEA; IN JOON KIM; YOUNG KWAN KIM et al.Thin solid films. 2008, Vol 516, Num 11, pp 3614-3617, issn 0040-6090, 4 p.Conference Paper

Synthesis and photo physical study of iridium complex of new pentafluorophenyl-substituted ligandsGUI YOUN PARK; JI HYUN SEO; YOUNG KWAN KIM et al.Thin solid films. 2008, Vol 516, Num 11, pp 3622-3626, issn 0040-6090, 5 p.Conference Paper

Adaptive tetrahedral element generation and refinement to improve the quality of bulk metal forming simulationLEE, M. C; JOUN, M. S; LEE, J. K et al.Finite elements in analysis and design. 2007, Vol 43, Num 10, pp 788-802, issn 0168-874X, 15 p.Article

Mechanical behavior of Cu₅₄Ni₆Zr₂₂Ti₁₈ bulk amorphous alloy during multi-pass warm rollingKIM, H. J; LEE, J. K; KIM, T. S et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2007, Vol 449-451, pp 929-933, issn 0921-5093, 5 p.Conference Paper